IMPROVED CPU COOLING
Ultra-low thermal impedance lowers CPU temperatures vs common thermal paste.
FILL IN THE GAP
XTM50’s low-viscosity allows it to easily fill microscopic abrasions and channels for peak thermal transfer.
INSTALLATION MADE EASY
An included application stencil and spreader take the guesswork out of applying XTM50 to your CPU cooler.
RELIABLE AND SAFE
XTM50’s high-stability liquid compound lasts for years with no drying, cracking or change in consistency. Non-conductive and contains zero volatile compounds.
Weight
5g
Thermal Conductivity
5.0 W/mK
Thermal Impedance
0.009°C -in²/W
Viscosity
2300K cPs
Specific Gravity
2.7g/cm3
