, , , ,

Zalman STC9 Super Conducting Thermal Paste, 4g

Product Code: ZM-STC9 SKU: PCK10371 Categories: , , , ,
Zalman
Availability:

3 in stock


  • Excellent Stability: Zalman STC 9 effective thermal conductivity allows heat from CPU or any computer chips to cool down and very safe as there is no electrical conductivity.
  • Measuring Graduations for convenience: Scale marking on the syringe allows accurate and visual measurement of the content while using or reusing the product.
  • Optimum Viscosity: Particle size technology provides optimal filler density to conveniently use on any type of computer chips.
  • East to use and store: Syringe type which is easy to use and rubber-cap prevents liquid content from being hardened over a period of thime when reused
  • Outstanding Durability and cooling performance: STC 9 can fill up space between the heatsink and CPU to maximize cooling performance &RoHS Certified

KD 6.000

3 in stock

Product price
Additional options total:
Order total:

1.[MEASURING GRADUATIONS FOR CONVENIENCE] SCALE MARKINGS ON THE SYRINGE ALLOWS ACCURATE AND VISUAL MEASUREMENT OF THE CONTENT WHILE USING OR REUSING THE PRODUCT.

2. [EASY TO USE AND STORE] ZALMAN STC 9 THERMAL COMPOUND IS SYRINGE TYPE WHICH IS EASY TO USE AND RUBBER-CAP PREVENTS LIQUID CONTENT FROM BEING HARDENED OVER A PERIOD OF TIME WHEN REUSED.

3. [BEST COOLING PERFORMANCE] HIGHLY EFFECTIVE THERMAL CONDUCTIVITY ALLOWS HEAT FROM CPU OR ANY COMPUTER CHIPS TO COOL DOWN AND VERY SAFE AS THERE IS NO ELECTRICAL CONDUCTIVITY.

4. [OPTIMUM VISCOSITY] PARTICLE SIZE TECHNOLOGY PROVIDES OPTIMAL FILLER DENSITY TO CONVENIENTLY USE ON ANY TYPE OF COMPUTER CHIPS.

5. [OUTSTANDING DURABILITY AND COOLING PERFORMANCE] ZALMAN THERMAL COMPOUND ZM STC9 IN ANY APPLICATION CAN LAST UP TO 10 YEARS, WHICH CAN FILL UP SPACE BETWEEN THE HEATSINK AND CPU TO MAXIMIZE COOLING PERFORMANCE.

getImage

getImage

getImage

getImage

getImage

getImage

Brand Name

Zalman

Model ZM-STC9
Dimensions (Syringe) 117.4 (W) x 21.2 (L) x 15 (H) mm
Weight 4g
Color Gray
Thermal Conductivity 9.1 W/m·K
Density 2.7g/㎤
Viscosity 250 Pa.s
Materials Silicone Oil, Alumina, Aluminum, Zinc Oxide